SIGNAL AND POWER INTEGRITY OF HIGH-SPEED PRINTED CIRCUIT BOARDS

(Seminars, Webinar, Informatic laboratory, Frontal teaching)

  • Language: ENGLISH
  • Campus: AULA VIRTUALE, MILANO CITTÀ STUDI
  • Enrollment: 21-04-2022to hour 12:00 on
    09-05-2022
  • Subject area: Tools|Tech and society
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Teacher in charge
GRASSI FLAVIA
Credits
2
Hours to attend
20
Prerequisites

Basic concepts of transmission line theory

Max. number of students
100
Topics:
High-Speed Interconnects, Signal and Power Integrity
Tag
Engineering, Software

Description of the initiative

Design and analysis of interconnects in high-speed electronic systems; understanding of high-speed signal propagation and signal and power integrity concepts; electromagnetic simulation tools and experimental techniques.
  • Introduction of signal and power integrity issues for the design of high-speed interconnects. Activity: lectures.
  • Keysight Technologies: Presentation of electromagnetic and signal integrity simulation with Keysight EDA tools. Interactive sessions aimed at guiding the students through the solution of canonical problems via circuit and electromagnetic solvers. Activity: simulation.
  • SECO Embedded Creators: Presentation of design issues of a computer on a board; experimental demonstration with debugging of signal integrity failures in a practical use case (udoo project). Activity: measurement and simulation. Ansys: Presentation of electromagnetic and signal integrity simulation with HFSS e Slwave tools. Interactive sessions aimed at guiding the students through the solution of canonical problems via circuit and electromagnetic solvers. Main activity: Numerical simulations
  • STMicroelectronics: Presentation of design issues of packages; introduction of electromagnetic simulation as a tool to optimize package design; Simulation of real test cases.

Duration

dal May 2022 a June 2022

Calendar

11-05    8:15-11:15
12-05    8:15-11:15
18-05    8:15-10:15
25-05    8:15-11:15
27-05    10:15-13:15
27-05    14:15-18:15

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