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SIGNAL AND POWER INTEGRITY OF HIGH-SPEED PRINTED CIRCUIT BOARDS

(ONLINE)

  • Language: ENGLISH
  • Campus: AULA VIRTUALE
  • Enrollment: 22-03-2021to hour 12:00 on
    03-05-2021
  • Subject area: Tools
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Teacher in charge
GRASSI FLAVIA
Credits
2
Hours to attend
22
Prerequisites

Basic concepts of transmission line theory.

Max. number of students
200
Topics:
High-Speed Interconnects, Signal and Power Integrity
Tag
Energy, Engineering

Description of the initiative

Design and analysis of interconnects in high-speed electronic systems; understanding of high-speed signal propagation and signal and power integrity concepts; electromagnetic simulation tools and experimental techniques.
  • Introduction of signal and power integrity issues for the design of high-speed interconnects. Activity: lectures.
  • Keysight Technologies: Presentation of electromagnetic and signal integrity simulation with Keysight EDA tools. Interactive sessions aimed at guiding the students through the solution of canonical problems via circuit and electromagnetic solvers. Activity: simulation.
  • SECO Embedded Creators: Presentation of design issues of a computer on a board; experimental demonstration with debugging of signal integrity failures in a practical use case (udoo project). Activity: measurement and simulation. Ansys: Presentation of electromagnetic and signal integrity simulation with HFSS e Slwave tools. Interactive sessions aimed at guiding the students through the solution of canonical problems via circuit and electromagnetic solvers. Main activity: Numerical simulations
  • STMicroelectronics: Presentation of design issues of packages; introduction of electromagnetic simulation as a tool to optimize package design; Simulation of real test cases.

Duration

dal May 2021 a June 2021

Calendar

06-mag 8:15-12:15 - Intro to SIPI - 4h
12-mag 9:15-12:15 - Keysight - 3h
19-mag 9:15-12:15 - SECO - 3h
20-mag 8:15-11:15 - ANSYS - 3h
20-mag 12:15-15:15 - STMicroelectronics - 3h
03-giu   8:15-12:15 - CST - 4h

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