SIGNAL AND POWER INTEGRITY OF HIGH-SPEED PRINTED CIRCUIT BOARDS
(Frontal teaching)
- Language: ENGLISH
- Campus: SPAZIO ESTERNO AL POLIMI
- Enrollment: 30-04-2020to hour 12:00 on
15-05-2020
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- Teacher in charge
- GRASSI FLAVIA
- Credits
- 2
- Hours to attend
- 22
- Max. number of students
- 240
Description of the initiative
Design and analysis of interconnects in high-speed electronic systems; understanding of high-speed signal propagation and signal and power integrity concepts; electromagnetic simulation tools and experimental techniques.
- Introduction of signal and power integrity issues for the design of high-speed interconnects. Activity: lectures.
- Keysight Technologies: Presentation of electromagnetic and signal integrity simulation with Keysight EDA tools. Interactive sessions aimed at guiding the students through the solution of canonical problems via circuit and electromagnetic solvers. Activity: simulation.
- SECO Embedded Creators: Presentation of design issues of a computer on a board; experimental demonstration with debugging of signal integrity failures in a practical use case (udoo project). Activity: measurement and simulation. Ansys: Presentation of electromagnetic and signal integrity simulation with HFSS e Slwave tools. Interactive sessions aimed at guiding the students through the solution of canonical problems via circuit and electromagnetic solvers. Main activity: Numerical simulations
- STMicroelectronics: Presentation of design issues of packages; introduction of electromagnetic simulation as a tool to optimize package design; Simulation of real test cases.
Duration
dal May 2020 a June 2020
Calendar
21/5 (A) - 15:15/18:15 -Intro to SIPI
22/5 - 08:15/11:15 -Keysight
28/5 (A) - 15:15/18:15 -SECO
29/5 (M) - 08:15/11:15 -ANSYS
29/5 (A) - 14:15/18:15 -STMicroelectronics
05/06 -08:15/11:15 e 13:15/15:15 -CST